Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)

Expected Outcome: Advanced integrated photonic devices and circuits with enhanced functionality and performance enabling wider application across multiple sectors including digital, automotive, industrial, health and security Reinforced competitiveness of EU photonics actors by demonstrating advancements in representative system configurations and validating real-world applicability Significantly improved performance of electro-optic systems in applications such as communication, computing, sensing, medical diagnostics, data processing, AI supporting the introduction of photonic elements into such systems Low power consumption sensors with increased performance in application domains Scope: R&I should enhance the functionality, efficiency, and integration of photonic devices and circuits with a focus extended system performance. Action should address at least two of the following aspects. Enhanced performance through improved spectral purity, wavelength coverage, output power and noise characteristics. Increased modulation or detection speeds going beyond the capability of existing PIC material platforms, improved signal-processing capabilities, and integration of novel materials such as thin-film LiNbO3, BTO, graphene, silicon carbide, phase change materials and TMDCs. Miniaturised, high-complexity photonic circuits (e.g. multilayer photonics, chiplets, multiple integrated functional elements), scalable interconnects and electronics-photonics integration (co-packaged,…