Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration

Expected Outcome: This topic will open up new opportunities for European-based semiconductor packaging companies and their supply chain by building on currently available services of RTOs and all Chips JU pilot lines. The LFA projects should prepare and speed up the transfer of technologies from pilot lines to industrial deployment. In addition, projects should expand the advanced packaging ecosystem in Europe and boost its competitiveness by offering a fast path towards industrialization of European semiconductor technology. Through possible involvement of appropriate actors across the value chain – from materials, substrate, equipment, and test providers through packaging companies and their European customers – proposed projects should build a strong European innovation and transfer ecosystem for advanced packaging solutions, contributing to new and resilient supply chains in Europe.